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- W2391457085 abstract "A new epoxy resin containing both naphthalene and dicyclopentadiene(DCPD) group was synthesized using 1-naphthol and DCPD as starting materials.Its chemical structures were characterized with FTIR spectroscopy,NMR,MS,and GPC analyses.The epoxy value determined by HCl/acetone titration was 0.351.The physical properties of the resulting polymers cured with 4,4-diaminodiphenylsulfone were evaluated with dynamic mechanical thermal analyses(DMTA) and thermogravimetric analyses(TGA).The cured polymer showed great improvement in heat resistant properties including remarkably higher glass transition temperature(tg=236.2 ℃) and thermal stability.The polymer also had better moisture resistance because of the hydrophobic nature of DCPD and naphthyl groups." @default.
- W2391457085 created "2016-06-24" @default.
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- W2391457085 date "2007-01-01" @default.
- W2391457085 modified "2023-09-30" @default.
- W2391457085 title "Synthesis of novel high heat resistant epoxy resin containing naphthyl structure" @default.
- W2391457085 hasPublicationYear "2007" @default.
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