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- W2391612964 abstract "This paper attempted to integrate both reviewing on recent literatures and actual experiences in wire bonding process and provide a comprehensive review on bonding procedure,bonder motions,key bonding parameters,properties of bonding materials,designs of bonding tools as well as joining mechanism.At the same time some issues such as EFO-open,golf bond,short tail,non-stick on pad and lead were analysed;the solutions and recent developments to these issues were discussed.In addition,the application and special points of copper wire in wire bonding were also focused on.Because of the limitation of paper page,only key process factors were reviewed briefly;while this paper provided an opportunity to understand wire bonding well and brought a great benefit to the solving of whether actual operation issues or basic bonding principles." @default.
- W2391612964 created "2016-06-24" @default.
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- W2391612964 date "2013-01-01" @default.
- W2391612964 modified "2023-10-13" @default.
- W2391612964 title "A Review on Wire Bonding Process in Electronic Manufacturing" @default.
- W2391612964 hasPublicationYear "2013" @default.
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