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- W2391755990 abstract "IC manufacturing faced the challenges of physical limits,3D packaging technology has increasingly become the focus of the microelectronics industry.Dissertate the structure and characteristics of 3D packaging technology,mainstream multi-layer substrate technology classification,and the development of common bonding technologies.Pay attention to the international development of TSV technology over the past few years,Especially,TSV key technologies,such as wafer thinning technology,through-hole manufacturing technology and bonding technology.Give out the TSV technology development trend with the strong demands around 2015." @default.
- W2391755990 created "2016-06-24" @default.
- W2391755990 creator A5074803784 @default.
- W2391755990 date "2009-01-01" @default.
- W2391755990 modified "2023-09-25" @default.
- W2391755990 title "Technology of 3D Packaging and TSV" @default.
- W2391755990 hasPublicationYear "2009" @default.
- W2391755990 type Work @default.
- W2391755990 sameAs 2391755990 @default.
- W2391755990 citedByCount "0" @default.
- W2391755990 crossrefType "journal-article" @default.
- W2391755990 hasAuthorship W2391755990A5074803784 @default.
- W2391755990 hasConcept C117671659 @default.
- W2391755990 hasConcept C119599485 @default.
- W2391755990 hasConcept C127413603 @default.
- W2391755990 hasConcept C187937830 @default.
- W2391755990 hasConcept C193149544 @default.
- W2391755990 hasConcept C2988118331 @default.
- W2391755990 hasConcept C530198007 @default.
- W2391755990 hasConcept C59088047 @default.
- W2391755990 hasConcept C69567186 @default.
- W2391755990 hasConcept C78519656 @default.
- W2391755990 hasConceptScore W2391755990C117671659 @default.
- W2391755990 hasConceptScore W2391755990C119599485 @default.
- W2391755990 hasConceptScore W2391755990C127413603 @default.
- W2391755990 hasConceptScore W2391755990C187937830 @default.
- W2391755990 hasConceptScore W2391755990C193149544 @default.
- W2391755990 hasConceptScore W2391755990C2988118331 @default.
- W2391755990 hasConceptScore W2391755990C530198007 @default.
- W2391755990 hasConceptScore W2391755990C59088047 @default.
- W2391755990 hasConceptScore W2391755990C69567186 @default.
- W2391755990 hasConceptScore W2391755990C78519656 @default.
- W2391755990 hasLocation W23917559901 @default.
- W2391755990 hasOpenAccess W2391755990 @default.
- W2391755990 hasPrimaryLocation W23917559901 @default.
- W2391755990 hasRelatedWork W1964639570 @default.
- W2391755990 hasRelatedWork W1983382316 @default.
- W2391755990 hasRelatedWork W1998290008 @default.
- W2391755990 hasRelatedWork W2004728120 @default.
- W2391755990 hasRelatedWork W2011636747 @default.
- W2391755990 hasRelatedWork W2035395130 @default.
- W2391755990 hasRelatedWork W2066194009 @default.
- W2391755990 hasRelatedWork W2147546542 @default.
- W2391755990 hasRelatedWork W2153747599 @default.
- W2391755990 hasRelatedWork W2158114837 @default.
- W2391755990 hasRelatedWork W2158152750 @default.
- W2391755990 hasRelatedWork W2292793337 @default.
- W2391755990 hasRelatedWork W2344954854 @default.
- W2391755990 hasRelatedWork W2382778647 @default.
- W2391755990 hasRelatedWork W2382858093 @default.
- W2391755990 hasRelatedWork W2383813537 @default.
- W2391755990 hasRelatedWork W2385019218 @default.
- W2391755990 hasRelatedWork W2391076920 @default.
- W2391755990 hasRelatedWork W2510753316 @default.
- W2391755990 hasRelatedWork W2093250744 @default.
- W2391755990 isParatext "false" @default.
- W2391755990 isRetracted "false" @default.
- W2391755990 magId "2391755990" @default.
- W2391755990 workType "article" @default.