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- W2392510138 abstract "Thermosetting polyimides are being developed for use as matrix resins in structurally efficient advanced composites in aircraft,electronic/electrical materials for printed circuit board(PCB) and thermal insulation materials.Many different chemical approaches have been used to synthesize thermosetting polyimide resins which are easier to process than their thermoplastic counterparts.Furthermore,melt processing window can be adjusted by using different reactive groups.With appropriate reactive sites,no volatile is released during curing.In this article,recent advances in thermosetting polyimide resin are presented.Some end capped polyimides are detailed,such as nadimides and allyl nadic-imides,acetylene and phenylacetylene terminated polyimides,bismaleimides and maleimide functionalized polyimides,phenylmaleimide end capped polyimide,benzocyclobutenes,etc.Their relationships between structures and properties and thermal curing mechanisms of different oligomer are presented.Their development trend and applications in PCB are summarized." @default.
- W2392510138 created "2016-06-24" @default.
- W2392510138 creator A5027038454 @default.
- W2392510138 date "2007-01-01" @default.
- W2392510138 modified "2023-09-23" @default.
- W2392510138 title "Recent Advances in Thermosetting Polyimide and Its Applications in Printed Circuit Board" @default.
- W2392510138 hasPublicationYear "2007" @default.
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