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- W2392746632 abstract "The chip encapsulation technology has undergone the transformations of generations from DIP, QFP, PGA,BGA, CSP to MXM. The technical qualifications have become more and more advanced, in which the proportion of the chip area to the package area increasingly approaches 1, applicable frequency is higher and higher, heat resisting performance is better and better, the number of pins increases, the distance between pins reduces, the weight is lowered, the reliability increases and the application is more convenient." @default.
- W2392746632 created "2016-06-24" @default.
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- W2392746632 date "2007-01-01" @default.
- W2392746632 modified "2023-09-28" @default.
- W2392746632 title "CPU Packaging Forms of Development" @default.
- W2392746632 hasPublicationYear "2007" @default.
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