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- W2392782120 abstract "To prepare a good performance Cu /CuNi thin-film thermocouple by magnetron sputtering,an orthogonal experiment with four factors sample temperature,substrate-to-target distance,sputtering power and air pressure was designed to study the effects of preparation processes on the thin film resistivity after the critical dimension of thin film was determined. The results show that the sample temperature is the key factor to thinfilm resistivity,which decreases with the sample temperature increasing in a certain range,and the optimal preparation process for the lowest resistivity has been obtained. Based on thin-film theory of conductance and combined with film microstructure and surface morphology,the reason of temperature dependence of electrical resistivity was explained." @default.
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- W2392782120 date "2014-01-01" @default.
- W2392782120 modified "2023-09-23" @default.
- W2392782120 title "Optimization of preparation process of Cu /CuNi thin-film thermocouple" @default.
- W2392782120 hasPublicationYear "2014" @default.
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