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- W2392932439 abstract "Creep fatigue of solder joint is one of the most important reasons for the failure of electronics products,and evaluating the fatigue life of solder joint quantitatively is necessary for the reliability analysis of electronics products.First the creep-fatigue models for solder joint described in the IPC standards was summarized,then how to use these models to analyze and predict the life of solder joint in real cases using an example was showed,and finally the effects of 6 key parameters on the fatigue life of solder joint and the optimization of parameter design was discussed.When the maximum distance between two solder joints,measured from the center of two joints,are larger than 1.143 0 and 0.063 5 cm respectively for components with and without pin,the fatigue life of component decreases sharply with increasing distance.In addition,thermal mismatch is still a main factor influencing the fatigue life of solder joint." @default.
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- W2392932439 date "2010-01-01" @default.
- W2392932439 modified "2023-09-25" @default.
- W2392932439 title "Quantitative method evaluating the fatigue life of solder joint and some factors influencing the evaluation" @default.
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