Matches in SemOpenAlex for { <https://semopenalex.org/work/W2393060896> ?p ?o ?g. }
Showing items 1 to 69 of
69
with 100 items per page.
- W2393060896 abstract "Thermal stress in a semiconductor package is one of the major reason causes delamination after stress testing. To reduce total stress in a package, the reduction of stress of epoxy molding compound was studied in this paper. Different raw material was applied into a standard formulation. Properties was compared. Stress index was calculated base on the test data.It was found with lower stress index of EMC, delamination to lead frame can be eliminated. All the finished material was molded on a SOIC 20L test vehicle and soaked with a Jedec MSL 3 condition. Delamination was checked after soaking and reflows. It was found with lower stress index of EMC, delamination to lead frame can be eliminated." @default.
- W2393060896 created "2016-06-24" @default.
- W2393060896 creator A5085027094 @default.
- W2393060896 date "2008-01-01" @default.
- W2393060896 modified "2023-09-26" @default.
- W2393060896 title "Stress Reduction of Epoxy Molding Compound and its Effect on Delamination" @default.
- W2393060896 hasPublicationYear "2008" @default.
- W2393060896 type Work @default.
- W2393060896 sameAs 2393060896 @default.
- W2393060896 citedByCount "0" @default.
- W2393060896 crossrefType "journal-article" @default.
- W2393060896 hasAuthorship W2393060896A5085027094 @default.
- W2393060896 hasConcept C121598971 @default.
- W2393060896 hasConcept C138885662 @default.
- W2393060896 hasConcept C151730666 @default.
- W2393060896 hasConcept C159985019 @default.
- W2393060896 hasConcept C166595027 @default.
- W2393060896 hasConcept C192562407 @default.
- W2393060896 hasConcept C21036866 @default.
- W2393060896 hasConcept C2779227376 @default.
- W2393060896 hasConcept C30239060 @default.
- W2393060896 hasConcept C41895202 @default.
- W2393060896 hasConcept C58097730 @default.
- W2393060896 hasConcept C67558686 @default.
- W2393060896 hasConcept C77928131 @default.
- W2393060896 hasConcept C79635011 @default.
- W2393060896 hasConcept C86803240 @default.
- W2393060896 hasConceptScore W2393060896C121598971 @default.
- W2393060896 hasConceptScore W2393060896C138885662 @default.
- W2393060896 hasConceptScore W2393060896C151730666 @default.
- W2393060896 hasConceptScore W2393060896C159985019 @default.
- W2393060896 hasConceptScore W2393060896C166595027 @default.
- W2393060896 hasConceptScore W2393060896C192562407 @default.
- W2393060896 hasConceptScore W2393060896C21036866 @default.
- W2393060896 hasConceptScore W2393060896C2779227376 @default.
- W2393060896 hasConceptScore W2393060896C30239060 @default.
- W2393060896 hasConceptScore W2393060896C41895202 @default.
- W2393060896 hasConceptScore W2393060896C58097730 @default.
- W2393060896 hasConceptScore W2393060896C67558686 @default.
- W2393060896 hasConceptScore W2393060896C77928131 @default.
- W2393060896 hasConceptScore W2393060896C79635011 @default.
- W2393060896 hasConceptScore W2393060896C86803240 @default.
- W2393060896 hasLocation W23930608961 @default.
- W2393060896 hasOpenAccess W2393060896 @default.
- W2393060896 hasPrimaryLocation W23930608961 @default.
- W2393060896 hasRelatedWork W1491170794 @default.
- W2393060896 hasRelatedWork W1977397101 @default.
- W2393060896 hasRelatedWork W1996627263 @default.
- W2393060896 hasRelatedWork W2034946825 @default.
- W2393060896 hasRelatedWork W2041072610 @default.
- W2393060896 hasRelatedWork W2051063477 @default.
- W2393060896 hasRelatedWork W2104910807 @default.
- W2393060896 hasRelatedWork W2113557759 @default.
- W2393060896 hasRelatedWork W2127741821 @default.
- W2393060896 hasRelatedWork W2145250159 @default.
- W2393060896 hasRelatedWork W2162951288 @default.
- W2393060896 hasRelatedWork W2164826760 @default.
- W2393060896 hasRelatedWork W2272339304 @default.
- W2393060896 hasRelatedWork W2529495344 @default.
- W2393060896 hasRelatedWork W2529850872 @default.
- W2393060896 hasRelatedWork W2536677901 @default.
- W2393060896 hasRelatedWork W2898895417 @default.
- W2393060896 hasRelatedWork W2918896571 @default.
- W2393060896 hasRelatedWork W2962611543 @default.
- W2393060896 hasRelatedWork W3088707489 @default.
- W2393060896 isParatext "false" @default.
- W2393060896 isRetracted "false" @default.
- W2393060896 magId "2393060896" @default.
- W2393060896 workType "article" @default.