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- W2393756476 abstract "An electroless plating process is suggested to obtain Ni-P-TiB2 containing 9～10 Wt % of TiB2 at a deposition rate of 15μm/h. Infiuences of various process parameters on deposition rate and TiB2 content in the compostie are discussed." @default.
- W2393756476 created "2016-06-24" @default.
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- W2393756476 date "1995-01-01" @default.
- W2393756476 modified "2023-09-23" @default.
- W2393756476 title "Ni-P-TiB_2 Electroless Plating" @default.
- W2393756476 hasPublicationYear "1995" @default.
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