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- W2393919910 abstract "The oxidation of Sn-0.7Cu was researched by static high temperature corrosive and the method of scrape off film on the liquid Sn-0.7Cu surface,and compared with the results of Sn-37Pb.The results indicate that the oxidation of Sn-0.7Cu is more than Sn-37Pb’s obviously on same temperature.The amount of oxidation residue on liquid solder surface increase with the frequency of scrape off the residue.The relation of the change of oxidation residue with time accord with the parabola rule.It is the basic reason of increase oxidation that the appetency of Sn-0.7Cu with oxygen is larger than Sn-37Pb and the surface film is loose.Increasing the consistency of surface film is the basic measure of decreasing oxidation reaction." @default.
- W2393919910 created "2016-06-24" @default.
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- W2393919910 date "2006-01-01" @default.
- W2393919910 modified "2023-09-26" @default.
- W2393919910 title "Thermooxidation Capability of Liquid Sn-Cu Solder on Constant Temperature" @default.
- W2393919910 hasPublicationYear "2006" @default.
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