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- W2394205538 abstract "With the development trend of the miniaturization and high integration degree of electronic products,the packaging technology is gradually experiencing a microelectronic era.This article introduces the key technologies of microelectronics packaging such as the chips interconnect technology,typical packaging and MCM.It also reviews the development trends and application prospects of microelectronics packaging technology." @default.
- W2394205538 created "2016-06-24" @default.
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- W2394205538 date "2013-01-01" @default.
- W2394205538 modified "2023-09-28" @default.
- W2394205538 title "An Overview of Microelectronic Packaging Technology and its Development Trend" @default.
- W2394205538 hasPublicationYear "2013" @default.
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