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- W2394442004 abstract "It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material、PCB、component、examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and lead-free solder were used together that should be paid attention to during the transfer stage are also analyzed entirely." @default.
- W2394442004 created "2016-06-24" @default.
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- W2394442004 date "2003-01-01" @default.
- W2394442004 modified "2023-09-25" @default.
- W2394442004 title "Application and Development of Surface Mount Technology" @default.
- W2394442004 hasPublicationYear "2003" @default.
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