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• W2415692975 endingPage "17137" @default.
• W2415692975 startingPage "17131" @default.
• W2415692975 abstract "Organic nanolayers attract much attention for the isolation and adhesion promotion of the Cu line and insulator in Cu interconnection of microelectronic devices. This paper proposes a strategy for selective formation of adhesion nanolayer on the insulator surface with etching it on Cu surface by Cu-oxide-assisted pyrolysis. After deposition of a uniform polyelectrolyte layer on both SiO2 and Cu surfaces, heat treatment at 350 °C in ambient nitrogen was applied. Then, a larger thickness decrease was observed on the polyelectrolyte layer on Cu when compared to that on SiO2. According to the TDS and XPS analysis, the polyelectrolyte layer was relatively stable on SiO2 up to the intrinsic decomposition temperature of the material, but on the Cu surface it decomposed to volatile small molecules at a lower temperature due to Cu2O-assisted oxidization. This substrate dependent selective pyrolysis was examined for 100 nm width Cu lines and SiO2 spaces, and then a patterned polyelectrolyte layer on the SiO2 surface was obtained with a single nanometer scale edge resolution." @default.
• W2415692975 created "2016-06-24" @default.
• W2415692975 creator A5030145040 @default.
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• W2415692975 creator A5075412015 @default.
• W2415692975 creator A5085129468 @default.
• W2415692975 date "2015-07-31" @default.
• W2415692975 modified "2023-09-23" @default.
• W2415692975 title "Cu-Oxide-Assisted Selective Pyrolysis of Organic Nanolayer on Patterned SiO₂–Cu Surface" @default.
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• W2415692975 doi "https://doi.org/10.1021/acsami.5b03835" @default.
• W2415692975 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/26200473" @default.
• W2415692975 hasPublicationYear "2015" @default.
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