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- W24406095 abstract "Ductile mode machining of silicon is hard to obtain due to the brittleness of silicon andhardness of tool materials. A brittle material will have little tendency to deform before itfractures when it is subjected to stress. Ceramic materials such as silicon carbide and silicon nitrideare hard and brittle to be machined. According to Thimmaiah et al. [1] brittle materials aredifficult to machine while maintaining the desired surface roughness, yet Sreejith [2] specifiedthat ductile machining of brittle materials is possible under controlled machining conditions.This is supported by works of J. Yan et al. [3], which stated that silicon is nominally brittlematerial but can be deformed plastically in machining, yielding ductile chips under theinfluence of high hydrostatic pressure.According to Mariayyah and Ravishankar [4], conventional grinding of these materials leavesmicro-cracks and pits on the surface. Other than that, these materials insist on furtherfinishing as lapping and polishing to ensure high quality surface finish. These finishingoperations such processes can be avoided if the materials can be machined similar to metals inductile regime machining. Recent machining studies on brittle materials such as silicon andgermanium have shown that ductile regime machining using a single point diamond tool canproduce a mirror-like finish wherein various machining parameters are provided and properlycontrolled such as spindle speed, depth of cut and feed rate, hence the material deformsplastically during machining.D.J Stephenson [5] stated that in conventional single point diamond turning, ductile materialssuch as aluminum and copper are usually used as material for mirror quality surface products.With the recent use of the single point diamond turning, strong demands for the ultraprecisionmachining of brittle materials such as silicon, germanium and glass are increasing.Hence, many works concerned with the machining of the brittle material have beenconducted. As a result of a ductile-to-brittle transition, it is not easy to machine brittlematerials to obtain mirror quality surface in nature due to the occurrence of the fracture.Y.S. Liao et al. [6] showed that in recent years, high speed machining (HSM) technology isbecoming matured due to the advance of machine tool and control system. A higher metalremoval rate is not the only advantage of HSM. It has the features of lower cutting force,improvement of the surface quality, no critical heat of the work piece, etc.This chapter focuses on how to improve the surface roughness and integrity of silicon byusing air blower at higher pressure in conventional machining. Thus, the optimal machiningparameters can be obtained to yield the predicted surface roughness analyzed by ANOVA." @default.
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- W24406095 date "2011-01-01" @default.
- W24406095 modified "2023-09-23" @default.
- W24406095 title "Implementation of high speed of silicon using diamond coated tools with air blowing" @default.
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