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- W2466769884 abstract "This work investigated the self-annealing effect of Cu directly electrodeposited on CoMo based barriers with different atomic ratios of Co to Mo. Cu electroplated on barrier with higher Co content expressed lower resistivity and resistance drop as well as higher texture coefficient of Cu (111). Comparisons are made between Cu electroplated directly on barriers and Cu on Cu seed. The resistivity of Cu electroplated on Co is close to that of Cu plated on Cu seed layer. Results show that with higher texture coefficient of (111) the Cu films will have lower resistance change during self-annealing." @default.
- W2466769884 created "2016-07-22" @default.
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- W2466769884 date "2016-05-01" @default.
- W2466769884 modified "2023-09-24" @default.
- W2466769884 title "Barrier layer dependence of self-annealing effect in directly electroplated copper films" @default.
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- W2466769884 doi "https://doi.org/10.1109/iitc-amc.2016.7507727" @default.
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