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- W2467058505 abstract "Leading-edge microcircuits are increasingly using low-K dielectrics to improve performance. These new materials complicate chip failure analysis, because of their softness. This paper presents the results of an evaluation of sectioning quality by various techniques, including FIB, and offers one solution for overcoming the challenges associated with cross-sectioning polyimide." @default.
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- W2467058505 date "1995-12-31" @default.
- W2467058505 modified "2023-09-23" @default.
- W2467058505 title "The use of PECVD glass coatings for the encapsulation of low-K dielectrics for failure analysis" @default.
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