Matches in SemOpenAlex for { <https://semopenalex.org/work/W2470230704> ?p ?o ?g. }
- W2470230704 abstract "To enable the continued scaling of integrated circuits, the semiconductor industry faces ongoing struggles to implement better low‐dielectric‐constant (low‐ k ) materials within the interconnect system. One of the biggest challenges to integrating new dielectrics is overcoming the low‐ k death curve—that is, the fatal falloff in mechanical properties associated with the low material densities required to achieve low k values. It is shown that amorphous hydrogenated boron carbide (a‐BC:H) films exhibit Young's modulus ( E ) values between two and ten times greater than those of state‐of‐the‐art Si‐based dielectric materials across a wide range of k values. In particular, optimized a‐BC:H films with moderate k values in the range of 3–4, in addition to possessing outstanding stiffness ( E ≈ 100–150 GPa), simultaneously exhibit excellent electrical properties (leakage current of <10 –8 A cm –2 at 2 MV cm –1 and breakdown voltage of >5 MV cm –1 ). Films in this range also demonstrate resistance to Cu diffusion to at least 600 °C, as well as chemical stability and etch properties suitable for low‐ k diffusion barrier/etch stop applications." @default.
- W2470230704 created "2016-07-22" @default.
- W2470230704 creator A5004364537 @default.
- W2470230704 creator A5007665943 @default.
- W2470230704 creator A5011882302 @default.
- W2470230704 creator A5017024713 @default.
- W2470230704 creator A5019436065 @default.
- W2470230704 creator A5033946101 @default.
- W2470230704 creator A5050456912 @default.
- W2470230704 creator A5063981194 @default.
- W2470230704 creator A5080937588 @default.
- W2470230704 creator A5083806030 @default.
- W2470230704 creator A5084332045 @default.
- W2470230704 creator A5088783885 @default.
- W2470230704 creator A5089005407 @default.
- W2470230704 creator A5089110545 @default.
- W2470230704 date "2016-05-30" @default.
- W2470230704 modified "2023-09-30" @default.
- W2470230704 title "Conquering the Low‐ <i>k</i> Death Curve: Insulating Boron Carbide Dielectrics with Superior Mechanical Properties" @default.
- W2470230704 cites W1227996127 @default.
- W2470230704 cites W163999250 @default.
- W2470230704 cites W1972591234 @default.
- W2470230704 cites W1985864490 @default.
- W2470230704 cites W2003978230 @default.
- W2470230704 cites W2007826165 @default.
- W2470230704 cites W2009221461 @default.
- W2470230704 cites W2009527542 @default.
- W2470230704 cites W2014873405 @default.
- W2470230704 cites W2015345245 @default.
- W2470230704 cites W2016879593 @default.
- W2470230704 cites W2035042332 @default.
- W2470230704 cites W2043513307 @default.
- W2470230704 cites W2052676749 @default.
- W2470230704 cites W2053996554 @default.
- W2470230704 cites W2060635590 @default.
- W2470230704 cites W2062441155 @default.
- W2470230704 cites W2064392256 @default.
- W2470230704 cites W2064774055 @default.
- W2470230704 cites W2067497964 @default.
- W2470230704 cites W2074141073 @default.
- W2470230704 cites W2075663303 @default.
- W2470230704 cites W2081164124 @default.
- W2470230704 cites W2086662549 @default.
- W2470230704 cites W2088808604 @default.
- W2470230704 cites W2091900811 @default.
- W2470230704 cites W2099889907 @default.
- W2470230704 cites W2108896313 @default.
- W2470230704 cites W2110154043 @default.
- W2470230704 cites W2118186792 @default.
- W2470230704 cites W2125585380 @default.
- W2470230704 cites W2125698659 @default.
- W2470230704 cites W2146174253 @default.
- W2470230704 cites W2166096548 @default.
- W2470230704 cites W2167068916 @default.
- W2470230704 cites W2170599376 @default.
- W2470230704 cites W2170946784 @default.
- W2470230704 cites W2280798795 @default.
- W2470230704 cites W253779177 @default.
- W2470230704 cites W2605133030 @default.
- W2470230704 cites W2951480869 @default.
- W2470230704 cites W583410313 @default.
- W2470230704 doi "https://doi.org/10.1002/aelm.201600073" @default.
- W2470230704 hasPublicationYear "2016" @default.
- W2470230704 type Work @default.
- W2470230704 sameAs 2470230704 @default.
- W2470230704 citedByCount "18" @default.
- W2470230704 countsByYear W24702307042017 @default.
- W2470230704 countsByYear W24702307042018 @default.
- W2470230704 countsByYear W24702307042019 @default.
- W2470230704 countsByYear W24702307042020 @default.
- W2470230704 countsByYear W24702307042021 @default.
- W2470230704 countsByYear W24702307042022 @default.
- W2470230704 countsByYear W24702307042023 @default.
- W2470230704 crossrefType "journal-article" @default.
- W2470230704 hasAuthorship W2470230704A5004364537 @default.
- W2470230704 hasAuthorship W2470230704A5007665943 @default.
- W2470230704 hasAuthorship W2470230704A5011882302 @default.
- W2470230704 hasAuthorship W2470230704A5017024713 @default.
- W2470230704 hasAuthorship W2470230704A5019436065 @default.
- W2470230704 hasAuthorship W2470230704A5033946101 @default.
- W2470230704 hasAuthorship W2470230704A5050456912 @default.
- W2470230704 hasAuthorship W2470230704A5063981194 @default.
- W2470230704 hasAuthorship W2470230704A5080937588 @default.
- W2470230704 hasAuthorship W2470230704A5083806030 @default.
- W2470230704 hasAuthorship W2470230704A5084332045 @default.
- W2470230704 hasAuthorship W2470230704A5088783885 @default.
- W2470230704 hasAuthorship W2470230704A5089005407 @default.
- W2470230704 hasAuthorship W2470230704A5089110545 @default.
- W2470230704 hasConcept C108225325 @default.
- W2470230704 hasConcept C123745756 @default.
- W2470230704 hasConcept C133386390 @default.
- W2470230704 hasConcept C159985019 @default.
- W2470230704 hasConcept C178790620 @default.
- W2470230704 hasConcept C185592680 @default.
- W2470230704 hasConcept C192562407 @default.
- W2470230704 hasConcept C2778794521 @default.
- W2470230704 hasConcept C2779866884 @default.
- W2470230704 hasConcept C31258907 @default.
- W2470230704 hasConcept C41008148 @default.
- W2470230704 hasConcept C49040817 @default.