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- W2470544071 abstract "In this paper, the effect of thermal aging to the Sn-Zn and Sn-Zn-Bi solders on Cu substrate was studied. Sn-Zn was chosen and the effect of addition of Bi was investigated in this work. In this research, Sn-9Zn and Sn-6Zn-4Bi were subjected to thermal aging for 24h, 72h, 120h at 75°C and 100°C respectively. Both solder shown increased of thickness intermetallic layer with increasing time. However, Sn-9Zn recorded higher increment of intermetallic layer compared to Sn-6Zn-4Bi. The hardness of solder joint on Cu substrate was decreased for both solders with increasing aging time." @default.
- W2470544071 created "2016-07-22" @default.
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- W2470544071 date "2016-07-01" @default.
- W2470544071 modified "2023-09-23" @default.
- W2470544071 title "Effect of Thermal Aging on the Interfacial of Sn-Zn and Sn-Zn-Bi Solders Joint on Cu Substrate" @default.
- W2470544071 doi "https://doi.org/10.4028/www.scientific.net/kem.700.113" @default.
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