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- W2472008736 abstract "Using the finite-element method, the thermal resistances of GaN laser diode devices in a TO 56 package for both epi-up configuration and epi-down configuration are calculated. The effects of various parameters on the thermal characteristics are analysed, and the thicknesses of the AlN submount for both epi-up configuration and epi-down configuration are optimized. The obtained result provides a reference for the parameter selection of the package materials." @default.
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- W2472008736 date "2012-08-01" @default.
- W2472008736 modified "2023-09-26" @default.
- W2472008736 title "Thermal analysis of GaN laser diodes in a package structure" @default.
- W2472008736 hasPublicationYear "2012" @default.
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