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- W2477306953 abstract "Fatigue damage of solder joints is a serious reliability concern in electronic packaging. In this study, a flip chip package was modeled to investigate the effects of underfill material properties and BT substrate thickness on solder joint reliability. The CTE was found to have the main effect and matching CTE between underfill and solder joint is the most important consideration in the selection of underfill material. This paper also presents a creep fatigue life prediction model for thermal cycling. The model is generated by correlating nonlinear finite element analysis with experimentally measured thermal fatigue lives of flip chip packages. This creep fatigue model may be used in parametric studies assessing the influence of flip chip or FCOB design parameters on solder fatigue life." @default.
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- W2477306953 date "2002-01-01" @default.
- W2477306953 modified "2023-09-25" @default.
- W2477306953 title "Analysis of solder joint reliability in flip chip packages" @default.
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