Matches in SemOpenAlex for { <https://semopenalex.org/work/W2486646475> ?p ?o ?g. }
- W2486646475 abstract "This chapter provides an overview of copper and low-k interconnect integration including process architectures, materials, performance, and reliability issues as well as future scaling challenges and potential technology directions. The simultaneous integration of copper with low-k dielectrics presented a significant challenge to the industry, and, while the manufacturing use of copper interconnects has become pervasive, each successive technology generation offers new challenges in terms of meeting density, performance, and reliability requirements. While the motivation for moving from aluminum to copper metalization and from oxide to low-k dielectrics is clear, significant material and process innovation has been and will continue to be required to meet the interconnect goals set forth in the International Technology Roadmap for Semiconductors. In the case of copper low-k interconnects, the redeposited film presents an additional challenge, as this material may then diffuse into the porous dielectric, thus degrading the intra-metal isolation and increasing the risk of copper contamination of the entire structure." @default.
- W2486646475 created "2016-08-23" @default.
- W2486646475 creator A5025600931 @default.
- W2486646475 creator A5038740503 @default.
- W2486646475 date "2017-12-19" @default.
- W2486646475 modified "2023-09-23" @default.
- W2486646475 title "Overview of Interconnect—Copper and Low-k Integration" @default.
- W2486646475 cites W1484452412 @default.
- W2486646475 cites W1484955800 @default.
- W2486646475 cites W1511874886 @default.
- W2486646475 cites W1538871329 @default.
- W2486646475 cites W1563576744 @default.
- W2486646475 cites W1589892726 @default.
- W2486646475 cites W1602398713 @default.
- W2486646475 cites W1606722225 @default.
- W2486646475 cites W1913063480 @default.
- W2486646475 cites W1914726055 @default.
- W2486646475 cites W1922881358 @default.
- W2486646475 cites W1930923338 @default.
- W2486646475 cites W1937252076 @default.
- W2486646475 cites W1955676966 @default.
- W2486646475 cites W1958832185 @default.
- W2486646475 cites W1975694818 @default.
- W2486646475 cites W1982808500 @default.
- W2486646475 cites W1994416434 @default.
- W2486646475 cites W2000697151 @default.
- W2486646475 cites W2025024161 @default.
- W2486646475 cites W2045294831 @default.
- W2486646475 cites W2045383364 @default.
- W2486646475 cites W2046384069 @default.
- W2486646475 cites W2046530548 @default.
- W2486646475 cites W2056825761 @default.
- W2486646475 cites W2062496493 @default.
- W2486646475 cites W2068873485 @default.
- W2486646475 cites W2073433607 @default.
- W2486646475 cites W2073730665 @default.
- W2486646475 cites W2075450024 @default.
- W2486646475 cites W2085817712 @default.
- W2486646475 cites W2090355199 @default.
- W2486646475 cites W2095810063 @default.
- W2486646475 cites W2097519580 @default.
- W2486646475 cites W2098058876 @default.
- W2486646475 cites W2101096828 @default.
- W2486646475 cites W2103191051 @default.
- W2486646475 cites W2105090530 @default.
- W2486646475 cites W2106324993 @default.
- W2486646475 cites W2107180895 @default.
- W2486646475 cites W2107288518 @default.
- W2486646475 cites W2109410779 @default.
- W2486646475 cites W2112331257 @default.
- W2486646475 cites W2113037198 @default.
- W2486646475 cites W2113466442 @default.
- W2486646475 cites W2113734460 @default.
- W2486646475 cites W2115362446 @default.
- W2486646475 cites W2115491251 @default.
- W2486646475 cites W2116915908 @default.
- W2486646475 cites W2119266391 @default.
- W2486646475 cites W2119933702 @default.
- W2486646475 cites W2120062652 @default.
- W2486646475 cites W2120149280 @default.
- W2486646475 cites W2120365316 @default.
- W2486646475 cites W2122603724 @default.
- W2486646475 cites W2123793459 @default.
- W2486646475 cites W2128685032 @default.
- W2486646475 cites W2134330871 @default.
- W2486646475 cites W2137586082 @default.
- W2486646475 cites W2142406425 @default.
- W2486646475 cites W2144220072 @default.
- W2486646475 cites W2152012121 @default.
- W2486646475 cites W2152995352 @default.
- W2486646475 cites W2157075294 @default.
- W2486646475 cites W2158460260 @default.
- W2486646475 cites W2162891036 @default.
- W2486646475 cites W2164412411 @default.
- W2486646475 cites W2167572825 @default.
- W2486646475 cites W2168744085 @default.
- W2486646475 cites W2170761575 @default.
- W2486646475 cites W2171592499 @default.
- W2486646475 cites W2532895182 @default.
- W2486646475 cites W2533043278 @default.
- W2486646475 cites W2533938810 @default.
- W2486646475 cites W2536315842 @default.
- W2486646475 cites W2537778776 @default.
- W2486646475 cites W2539509628 @default.
- W2486646475 cites W2540005098 @default.
- W2486646475 cites W2540014808 @default.
- W2486646475 cites W2540410941 @default.
- W2486646475 cites W2542837916 @default.
- W2486646475 cites W2543854738 @default.
- W2486646475 cites W2547031251 @default.
- W2486646475 cites W2548515546 @default.
- W2486646475 cites W2125966961 @default.
- W2486646475 cites W2143042017 @default.
- W2486646475 doi "https://doi.org/10.1201/9781420017663-2" @default.
- W2486646475 hasPublicationYear "2017" @default.
- W2486646475 type Work @default.
- W2486646475 sameAs 2486646475 @default.
- W2486646475 citedByCount "0" @default.
- W2486646475 crossrefType "book-chapter" @default.
- W2486646475 hasAuthorship W2486646475A5025600931 @default.