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• W2487132681 abstract "The characteristics of the UHF (Ultra-High-Frequency) plasma and SiO2 etching with this plasma source were investigated. A study on the optical emission spectroscopy shows that the plasma abounded in CF2 radicals, which indicates that the degree of the dissociation of feed gas is low. The ion saturation current density shows low dependence on pressure. The etching characteristics, such as SiO2 etch rate and RIE lag, also show low dependence on pressure. There is no significant effect of pressure on etched profile for a given ion saturation current density, a self-bias voltage and a selectivity of SiO2 to Photoresist (PR). These characteristics demonstrate that the UHF plasma source can be expected to provide a wide process window for pressure." @default.
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• W2487132681 date "1997-04-01" @default.
• W2487132681 modified "2023-09-27" @default.
• W2487132681 title "SiO 2 etching characteristics using UHF plasma source" @default.
• W2487132681 hasPublicationYear "1997" @default.
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