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- W2487508045 abstract "Publisher Summary This chapter discusses various aspects of chemistry, formulation, and properties of adhesives. Epoxy adhesives are the most widely used and most versatile of the polymer types and they combine numerous desirable properties including adhesive strength, thermal stability, reparability, dielectric properties, and retention of the properties under high thermomechanical stresses and environmental exposures such as humidity. Epoxy adhesives are widely used in electronics assembly and packaging and formed by polymerizing epoxy resins having one or more terminal glycidyl ether groups with a variety of curing agents, hardeners, or catalysts. Primary amines react rapidly with epoxy resins, even at room temperature, by opening up the epoxy ring and forming a secondary amine structure. Silicone adhesives, coatings, and encapsulants have been used from the inception of electronics and their formulations have improved steadily with each new generation of microelectronic assemblies. Moisture-cured silicones are used in many applications including sealing lids and housings, assembling components onto circuit boards, for chip-scale spacers and die attachment." @default.
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- W2487508045 date "2011-01-01" @default.
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- W2487508045 title "Chemistry, Formulation, and Properties of Adhesives" @default.
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- W2487508045 doi "https://doi.org/10.1016/b978-1-4377-7889-2.10003-8" @default.
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