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• W2489983655 abstract "The work presented in this paper is part of the investigation of a novel method for monitoring MEMS switch reliability during lifetime cycle testing. Switch degradation under repeated cycling is measured by monitoring changes in the closure dynamics of MEMS, electroplated Au, ohmic switches. Three analytical methods are compared for automatically extracting the switch closure time from the large-scale highly variable data and a combination of these methods is used to check data validity. Differences in the closure time results from the three methods are investigated and this indicates the suitability of each method with different data measurements. Combined with system modelling and post failure analysis reliable extraction of closure time variation can give an insight into the evolution of switch health throughout its operation cycle." @default.
• W2489983655 created "2016-08-23" @default.
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• W2489983655 date "2016-05-01" @default.
• W2489983655 modified "2023-09-26" @default.
• W2489983655 title "MEMS switch dynamic voltage profile analysis for reliability" @default.
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• W2489983655 doi "https://doi.org/10.1109/dtip.2016.7514877" @default.
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