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- W2499661345 abstract "It is well known that the kinetics and the reaction mechanism of epoxy curing determine the final network morphology and ultimately the physical properties of the epoxy resin. In recent years, the introduction of microwave processing of thermosetting materials has prompted the need for comprehensive microwave dielectric data, necessary to properly interpret the cure mechanism induced by electromagnetic radiation. In situ measurements at 2.45 GHz of the complex dielectric constant of an epoxy formulation undergoing thermal cure have been compared with theoretical predictions, based on changes in the dipole concentration and the changes in the relaxation time of the epoxy matrix with extent of cure. It has been shown that the rate of decrease of the dielectric constant primarily reflects the rate of crosslinking within the resin." @default.
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- W2499661345 date "1991-11-12" @default.
- W2499661345 modified "2023-09-25" @default.
- W2499661345 title "Dielectric Properties at Microwave Frequencies of Epoxy Undergoing Cure" @default.
- W2499661345 doi "https://doi.org/10.1021/bk-1991-0475.ch023" @default.
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