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- W2499696984 abstract "We successfully fabricated Al-foil/p-Si junctions by surface activated bonding (SAB). We found that the junctions revealed Schottky properties by measuring their current-voltage characteristics. We also found that the reverse-bias current of the junctions was decreased, i.e., their electrical characteristics were improved by annealing at temperatures below 200 °C. These results demonstrate that the bonding of metal foils should be useful for fabricating several-ten-μm-thick electrodes." @default.
- W2499696984 created "2016-08-23" @default.
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- W2499696984 date "2016-06-01" @default.
- W2499696984 modified "2023-09-26" @default.
- W2499696984 title "Electrical characteristics of Al foil/Si junctions by surface activated bonding method" @default.
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- W2499696984 doi "https://doi.org/10.1109/imfedk.2016.7521694" @default.
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