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- W2506269091 abstract "The effects of deposition process conditions and post-deposition annealing on the adhesion of electron beam evaporated Ti, Zr, Cu, and Cr to fully cured polyimide have been characterized by Secondary Ion Mass Spectrometry (SIMS), Auger Spectroscopy and mechanical peel testing. Mechanical peel testing was used to evaluate the relative strength of metal-polyimide adhesion and it's subsequent degradation, as a function of deposition conditions, and post processing. Auger and SIMS analysis provided complementary characterization of peel failure loci and interfaces associated with observed failure. SIMS analysis of as-deposited metal films was also used to characterize impurity levels, both metallic and gaseous, incorporated throughout the metal during deposition. SIMS was also used to characterize the absorption and redistribution of water during processing, using isotopically enriched water exposure. Together these techniques provide a us with a comprehensive understanding of factors influencing metal/polyimide adhesion degradation. Two modes of degradation are reported in this" @default.
- W2506269091 created "2016-08-23" @default.
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- W2506269091 date "1990-11-09" @default.
- W2506269091 modified "2023-10-18" @default.
- W2506269091 title "Metal—Polyimide Interfaces Characterized by Secondary Ion Mass Spectroscopy" @default.
- W2506269091 doi "https://doi.org/10.1021/bk-1990-0440.ch022" @default.
- W2506269091 hasPublicationYear "1990" @default.
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