FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2508054846> ?p ?o ?g. }

• W2508054846 abstract "This paper presents the design, fabrication, assembly, and characterization of a fully-integrated single-chip glass BGA package at 40/80 µm off-chip I/O pitch with multilayered wiring and through-package-vias (TPVs) at 160 µm pitch. The designed test vehicle emulates an application processor package for smart mobile applications, and enables for the first time measurements of DC signal transmission from the die to the board, through the package, at this density and pitch. A daisy chain test die, 10 mm x 10 mm in size, was designed to emulate a logic processor chip comprising 5448 I/Os distributed in four peripheral rows at 40/80 µm pitch and a central area array at 150 µm pitch. The test dies were fabricated and bumped with standard Cu pillars by ASE. The glass package design included four routing layers, with blind vias (BVs) and TPVs both at 150 µm pitch, to connect 176 I/Os to the board, with BGAs at 400µm pitch. Independent multi-level test structures were added for evaluation of TPV and BV yield during fabrication, as well as partial chip-and board-level interconnection yield and reliability. The TPVs in glass were achieved by a via-first process with a high-throughput plasma etching and primer drilling method. Semi-additive processes (SAP), combined with wet chemical surface treatment methods were applied for patterning of the multi-layer wiring with a minimum of 20 µm Cu trace width at 40 µm pitch. A fan-in fan-out finger design was implemented on the top layer for bump-on-trace chip-level interconnections. Chip assembly on glass panels was carried out by high-speed thermocompression bonding with non-conductive paste (TC-NCP) with the new high-performance APAMA chip-to-substrate (C2S) bonder by Kulicke and Soffa. Yield of each process step was evaluated through fabrication and assembly by DC electrical characterization of TPV, BV and chip-level interconnection daisy chains. Die-to-substrate interconnections were characterized, demonstrating signal transmission through the fully-integrated glass package for the first time at this I/O pitch." @default.
• W2508054846 created "2016-09-16" @default.
• W2508054846 creator A5008941910 @default.
• W2508054846 creator A5021546038 @default.
• W2508054846 creator A5030511319 @default.
• W2508054846 creator A5033555301 @default.
• W2508054846 creator A5038256711 @default.
• W2508054846 creator A5045655197 @default.
• W2508054846 creator A5053645476 @default.
• W2508054846 creator A5059656698 @default.
• W2508054846 creator A5076037279 @default.
• W2508054846 creator A5076907921 @default.
• W2508054846 creator A5089726137 @default.
• W2508054846 date "2016-05-01" @default.
• W2508054846 modified "2023-09-22" @default.
• W2508054846 title "Design, Demonstration and Characterization of Ultra-Thin Low-Warpage Glass BGA Packages for Smart Mobile Application Processor" @default.
• W2508054846 cites W1963484171 @default.
• W2508054846 cites W1964816091 @default.
• W2508054846 cites W1994527007 @default.
• W2508054846 cites W2030086185 @default.
• W2508054846 cites W2053801549 @default.
• W2508054846 cites W2114307572 @default.
• W2508054846 cites W2132416343 @default.
• W2508054846 doi "https://doi.org/10.1109/ectc.2016.372" @default.
• W2508054846 hasPublicationYear "2016" @default.
• W2508054846 type Work @default.
• W2508054846 sameAs 2508054846 @default.
• W2508054846 citedByCount "2" @default.
• W2508054846 countsByYear W25080548462017 @default.
• W2508054846 crossrefType "proceedings-article" @default.
• W2508054846 hasAuthorship W2508054846A5008941910 @default.
• W2508054846 hasAuthorship W2508054846A5021546038 @default.
• W2508054846 hasAuthorship W2508054846A5030511319 @default.
• W2508054846 hasAuthorship W2508054846A5033555301 @default.
• W2508054846 hasAuthorship W2508054846A5038256711 @default.
• W2508054846 hasAuthorship W2508054846A5045655197 @default.
• W2508054846 hasAuthorship W2508054846A5053645476 @default.
• W2508054846 hasAuthorship W2508054846A5059656698 @default.
• W2508054846 hasAuthorship W2508054846A5076037279 @default.
• W2508054846 hasAuthorship W2508054846A5076907921 @default.
• W2508054846 hasAuthorship W2508054846A5089726137 @default.
• W2508054846 hasConcept C100460472 @default.
• W2508054846 hasConcept C111106434 @default.
• W2508054846 hasConcept C119599485 @default.
• W2508054846 hasConcept C123745756 @default.
• W2508054846 hasConcept C126233035 @default.
• W2508054846 hasConcept C127413603 @default.
• W2508054846 hasConcept C136525101 @default.
• W2508054846 hasConcept C142724271 @default.
• W2508054846 hasConcept C159985019 @default.
• W2508054846 hasConcept C160671074 @default.
• W2508054846 hasConcept C165005293 @default.
• W2508054846 hasConcept C171250308 @default.
• W2508054846 hasConcept C192562407 @default.
• W2508054846 hasConcept C199360897 @default.
• W2508054846 hasConcept C204787440 @default.
• W2508054846 hasConcept C24326235 @default.
• W2508054846 hasConcept C2779227376 @default.
• W2508054846 hasConcept C31258907 @default.
• W2508054846 hasConcept C41008148 @default.
• W2508054846 hasConcept C49040817 @default.
• W2508054846 hasConcept C50296614 @default.
• W2508054846 hasConcept C59014099 @default.
• W2508054846 hasConcept C68928338 @default.
• W2508054846 hasConcept C71924100 @default.
• W2508054846 hasConcept C79072407 @default.
• W2508054846 hasConcept C9390403 @default.
• W2508054846 hasConcept C9395851 @default.
• W2508054846 hasConcept C94709252 @default.
• W2508054846 hasConceptScore W2508054846C100460472 @default.
• W2508054846 hasConceptScore W2508054846C111106434 @default.
• W2508054846 hasConceptScore W2508054846C119599485 @default.
• W2508054846 hasConceptScore W2508054846C123745756 @default.
• W2508054846 hasConceptScore W2508054846C126233035 @default.
• W2508054846 hasConceptScore W2508054846C127413603 @default.
• W2508054846 hasConceptScore W2508054846C136525101 @default.
• W2508054846 hasConceptScore W2508054846C142724271 @default.
• W2508054846 hasConceptScore W2508054846C159985019 @default.
• W2508054846 hasConceptScore W2508054846C160671074 @default.
• W2508054846 hasConceptScore W2508054846C165005293 @default.
• W2508054846 hasConceptScore W2508054846C171250308 @default.
• W2508054846 hasConceptScore W2508054846C192562407 @default.
• W2508054846 hasConceptScore W2508054846C199360897 @default.
• W2508054846 hasConceptScore W2508054846C204787440 @default.
• W2508054846 hasConceptScore W2508054846C24326235 @default.
• W2508054846 hasConceptScore W2508054846C2779227376 @default.
• W2508054846 hasConceptScore W2508054846C31258907 @default.
• W2508054846 hasConceptScore W2508054846C41008148 @default.
• W2508054846 hasConceptScore W2508054846C49040817 @default.
• W2508054846 hasConceptScore W2508054846C50296614 @default.
• W2508054846 hasConceptScore W2508054846C59014099 @default.
• W2508054846 hasConceptScore W2508054846C68928338 @default.
• W2508054846 hasConceptScore W2508054846C71924100 @default.
• W2508054846 hasConceptScore W2508054846C79072407 @default.
• W2508054846 hasConceptScore W2508054846C9390403 @default.
• W2508054846 hasConceptScore W2508054846C9395851 @default.
• W2508054846 hasConceptScore W2508054846C94709252 @default.
• W2508054846 hasLocation W25080548461 @default.
• W2508054846 hasOpenAccess W2508054846 @default.
• W2508054846 hasPrimaryLocation W25080548461 @default.

• next