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- W2510957558 abstract "Embedding electronics into a substrate offers the next level of performance and miniaturization in microelectronics technology. As components shrink in areal size (<1 mm2) and thickness (<100 μm), their handling and placement by conventional “pick-and-place” machines become more difficult. This chapter discusses the different laser-based additive processes used to embed electronics components and circuitry into a substrate. These processes are based on laser-induced forward transfer, or LIFT, which is an additive form of the more general laser direct write techniques. A historical survey of the different laser-assisted processes to transfer discrete components such as bare dies and surface-mount devices is presented. Then, the ability of LIFT to transfer functional materials such as metallic interconnects and electrochemically active materials (eg, for microbattery or photovoltaic applications) as direct replacement of discrete elements is discussed. Finally, examples of completed embedded circuits based on laser transfer of both discrete elements and interconnects are presented. Laser additive manufacturing is an emerging tool for fabricating embedded structures in next-generation microelectronics." @default.
- W2510957558 created "2016-09-16" @default.
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- W2510957558 date "2017-01-01" @default.
- W2510957558 modified "2023-10-18" @default.
- W2510957558 title "Laser additive manufacturing of embedded electronics" @default.
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- W2510957558 doi "https://doi.org/10.1016/b978-0-08-100433-3.00012-9" @default.
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