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- W2511280227 abstract "This chapter discusses the wafer-scale packaging technology for radio frequency microelectromechanical systems (RF MEMS) devices. First, the need for the wafer-level packaging of RF MEMS devices and the electrical effect of the packaging cap are assessed. This chapter shows examples of different types of packaging techniques, with emphasis on wafer-level bonding using hard cap materials, such as silicon and glass, and polymer cap materials, based on benzo-cyclobutene and PerMX." @default.
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- W2511280227 date "2013-01-01" @default.
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- W2511280227 title "Wafer-level packaging technology for RF MEMS" @default.
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- W2511280227 doi "https://doi.org/10.1533/9780857098610.1.258" @default.
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