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• W2511897787 abstract "Flip chip interconnects purely made out of Cu, so-called all-Cu interconnects, have the potential to overcome the present current capacity limit of state-of-the-art solder based interconnects, while meeting the demand for ever decreasing interconnect pitches. Parasitic effects in solder based interconnects, caused by interdiffusion of various metals, are mitigated in all-Cu interconnects. In this work, all-Cu interconnects were formed by the use of low temperature and pressureless sintering of Cu nanoparticles. Thereby, a Cu paste material was applied between the Cu pillars of a silicon chip and the Cu pads on a silicon substrate by a dip transfer method. The electrical and mechanical properties of sintered Cu were characterized on films of the same Cu pastes. The porous films resulted in 4.4 times higher electrical resistivity and one order of magnitude reduced mechanical stiffness and tensile strength compared to bulk Cu. All-Cu interconnects with a diameter of 30 μm and a pitch of 100 μm were formed with an optimized Cu particle distribution and sintering procedure. Resistances down to 1.7 ± 0.5 mO were measured for these all-Cu interconnects which is comparable to solder based benchmark interconnects. However, the porosity of the sintered Cu interconnect results in lower shear strength compared to the solder benchmark." @default.
• W2511897787 created "2016-09-16" @default.
• W2511897787 creator A5015292503 @default.
• W2511897787 creator A5018698234 @default.
• W2511897787 creator A5022774907 @default.
• W2511897787 creator A5028645817 @default.
• W2511897787 creator A5034679430 @default.
• W2511897787 creator A5043446274 @default.
• W2511897787 creator A5044752122 @default.
• W2511897787 creator A5047588579 @default.
• W2511897787 creator A5052364259 @default.
• W2511897787 creator A5085256391 @default.
• W2511897787 date "2016-05-01" @default.
• W2511897787 modified "2023-09-26" @default.
• W2511897787 title "All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering" @default.
• W2511897787 cites W1481533053 @default.
• W2511897787 cites W1559757544 @default.
• W2511897787 cites W1588429477 @default.
• W2511897787 cites W1982008918 @default.
• W2511897787 cites W2003170393 @default.
• W2511897787 cites W2032731236 @default.
• W2511897787 cites W2061239759 @default.
• W2511897787 cites W2066124466 @default.
• W2511897787 cites W2070713558 @default.
• W2511897787 cites W2101548689 @default.
• W2511897787 cites W2107949514 @default.
• W2511897787 cites W2155816545 @default.
• W2511897787 cites W2487925890 @default.
• W2511897787 cites W4375916423 @default.
• W2511897787 cites W3152337039 @default.
• W2511897787 doi "https://doi.org/10.1109/ectc.2016.42" @default.
• W2511897787 hasPublicationYear "2016" @default.
• W2511897787 type Work @default.
• W2511897787 sameAs 2511897787 @default.
• W2511897787 citedByCount "13" @default.
• W2511897787 countsByYear W25118977872017 @default.
• W2511897787 countsByYear W25118977872018 @default.
• W2511897787 countsByYear W25118977872019 @default.
• W2511897787 countsByYear W25118977872020 @default.
• W2511897787 countsByYear W25118977872022 @default.
• W2511897787 countsByYear W25118977872023 @default.
• W2511897787 crossrefType "proceedings-article" @default.
• W2511897787 hasAuthorship W2511897787A5015292503 @default.
• W2511897787 hasAuthorship W2511897787A5018698234 @default.
• W2511897787 hasAuthorship W2511897787A5022774907 @default.
• W2511897787 hasAuthorship W2511897787A5028645817 @default.
• W2511897787 hasAuthorship W2511897787A5034679430 @default.
• W2511897787 hasAuthorship W2511897787A5043446274 @default.
• W2511897787 hasAuthorship W2511897787A5044752122 @default.
• W2511897787 hasAuthorship W2511897787A5047588579 @default.
• W2511897787 hasAuthorship W2511897787A5052364259 @default.
• W2511897787 hasAuthorship W2511897787A5085256391 @default.
• W2511897787 hasConcept C111368507 @default.
• W2511897787 hasConcept C112950240 @default.
• W2511897787 hasConcept C119599485 @default.
• W2511897787 hasConcept C123745756 @default.
• W2511897787 hasConcept C127313418 @default.
• W2511897787 hasConcept C127413603 @default.
• W2511897787 hasConcept C127893833 @default.
• W2511897787 hasConcept C155672457 @default.
• W2511897787 hasConcept C159390177 @default.
• W2511897787 hasConcept C159750122 @default.
• W2511897787 hasConcept C159985019 @default.
• W2511897787 hasConcept C171250308 @default.
• W2511897787 hasConcept C191897082 @default.
• W2511897787 hasConcept C192562407 @default.
• W2511897787 hasConcept C2777289219 @default.
• W2511897787 hasConcept C2777581544 @default.
• W2511897787 hasConcept C2779227376 @default.
• W2511897787 hasConcept C31258907 @default.
• W2511897787 hasConcept C39432304 @default.
• W2511897787 hasConcept C41008148 @default.
• W2511897787 hasConcept C50296614 @default.
• W2511897787 hasConcept C544778455 @default.
• W2511897787 hasConcept C544956773 @default.
• W2511897787 hasConcept C68928338 @default.
• W2511897787 hasConcept C69990965 @default.
• W2511897787 hasConcept C79072407 @default.
• W2511897787 hasConceptScore W2511897787C111368507 @default.
• W2511897787 hasConceptScore W2511897787C112950240 @default.
• W2511897787 hasConceptScore W2511897787C119599485 @default.
• W2511897787 hasConceptScore W2511897787C123745756 @default.
• W2511897787 hasConceptScore W2511897787C127313418 @default.
• W2511897787 hasConceptScore W2511897787C127413603 @default.
• W2511897787 hasConceptScore W2511897787C127893833 @default.
• W2511897787 hasConceptScore W2511897787C155672457 @default.
• W2511897787 hasConceptScore W2511897787C159390177 @default.
• W2511897787 hasConceptScore W2511897787C159750122 @default.
• W2511897787 hasConceptScore W2511897787C159985019 @default.
• W2511897787 hasConceptScore W2511897787C171250308 @default.
• W2511897787 hasConceptScore W2511897787C191897082 @default.
• W2511897787 hasConceptScore W2511897787C192562407 @default.
• W2511897787 hasConceptScore W2511897787C2777289219 @default.
• W2511897787 hasConceptScore W2511897787C2777581544 @default.
• W2511897787 hasConceptScore W2511897787C2779227376 @default.
• W2511897787 hasConceptScore W2511897787C31258907 @default.
• W2511897787 hasConceptScore W2511897787C39432304 @default.
• W2511897787 hasConceptScore W2511897787C41008148 @default.
• W2511897787 hasConceptScore W2511897787C50296614 @default.
• W2511897787 hasConceptScore W2511897787C544778455 @default.

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