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• W2514911165 abstract "In this work, we show that Cu-Sn based nanowires can be used as a one-dimensional (1-D) diffusion couple to study the atomic diffusion. In order to control the nano-soldering process and form reliable nano-joints (nanoscale interconnects between nanowires), fundamental study of wetting and intermetallic diffusion at the small dimension is necessary. An electrodeposition method is used to synthesize multisegmented nanowires in nanoporous templates in the diameter range of 15-200 nm and length up to 20 µm. By choosing two-segment Sn-Cu nanowires and symmetric three-segment Sn-Cu-Sn nanowires as the model systems in which Sn acts as the solder element and Cu serves as a functional element, we aim to understand the nanoscale soldering reaction along the one-dimension. The morphological evolutions of Sn and Cu segments and Kirkendall void formation in the Cu segment during the oven based soldering process have been observed. The fundamental principles of diffusion kinetics, primarily at a phenomenological level, are discussed. These studies and results provide important understanding in the design, assembly and integration of functional nanowires into nanoelectronics and nanodevices." @default.
• W2514911165 created "2016-09-16" @default.
• W2514911165 creator A5009173681 @default.
• W2514911165 creator A5020994101 @default.
• W2514911165 creator A5064555398 @default.
• W2514911165 creator A5085174782 @default.
• W2514911165 creator A5091863721 @default.
• W2514911165 date "2016-05-01" @default.
• W2514911165 modified "2023-09-27" @default.
• W2514911165 title "Synthesis and Characterization of One-Dimensional Cu-Sn Nanowire Diffusion Couples for Nanowire Assembly and Interconnection" @default.
• W2514911165 cites W1603161598 @default.
• W2514911165 cites W1972502613 @default.
• W2514911165 cites W1987004587 @default.
• W2514911165 cites W1999243081 @default.
• W2514911165 cites W2022184692 @default.
• W2514911165 cites W2029184335 @default.
• W2514911165 cites W2034360089 @default.
• W2514911165 cites W2036059229 @default.
• W2514911165 cites W2040761870 @default.
• W2514911165 cites W2042028632 @default.
• W2514911165 cites W2064109888 @default.
• W2514911165 cites W2083521045 @default.
• W2514911165 cites W2084273768 @default.
• W2514911165 cites W2084373860 @default.
• W2514911165 cites W2118209077 @default.
• W2514911165 cites W2125132639 @default.
• W2514911165 cites W2146423290 @default.
• W2514911165 cites W2150969451 @default.
• W2514911165 cites W2230868583 @default.
• W2514911165 cites W2318688139 @default.
• W2514911165 cites W2335678772 @default.
• W2514911165 cites W3089876287 @default.
• W2514911165 cites W391166728 @default.
• W2514911165 doi "https://doi.org/10.1109/ectc.2016.101" @default.
• W2514911165 hasPublicationYear "2016" @default.
• W2514911165 type Work @default.
• W2514911165 sameAs 2514911165 @default.
• W2514911165 citedByCount "2" @default.
• W2514911165 countsByYear W25149111652018 @default.
• W2514911165 crossrefType "proceedings-article" @default.
• W2514911165 hasAuthorship W2514911165A5009173681 @default.
• W2514911165 hasAuthorship W2514911165A5020994101 @default.
• W2514911165 hasAuthorship W2514911165A5064555398 @default.
• W2514911165 hasAuthorship W2514911165A5085174782 @default.
• W2514911165 hasAuthorship W2514911165A5091863721 @default.
• W2514911165 hasConcept C121332964 @default.
• W2514911165 hasConcept C123745756 @default.
• W2514911165 hasConcept C131024122 @default.
• W2514911165 hasConcept C141400236 @default.
• W2514911165 hasConcept C171250308 @default.
• W2514911165 hasConcept C191897082 @default.
• W2514911165 hasConcept C192562407 @default.
• W2514911165 hasConcept C27501479 @default.
• W2514911165 hasConcept C2780026712 @default.
• W2514911165 hasConcept C31258907 @default.
• W2514911165 hasConcept C41008148 @default.
• W2514911165 hasConcept C45206210 @default.
• W2514911165 hasConcept C48940184 @default.
• W2514911165 hasConcept C50296614 @default.
• W2514911165 hasConcept C69357855 @default.
• W2514911165 hasConcept C74214498 @default.
• W2514911165 hasConcept C97355855 @default.
• W2514911165 hasConceptScore W2514911165C121332964 @default.
• W2514911165 hasConceptScore W2514911165C123745756 @default.
• W2514911165 hasConceptScore W2514911165C131024122 @default.
• W2514911165 hasConceptScore W2514911165C141400236 @default.
• W2514911165 hasConceptScore W2514911165C171250308 @default.
• W2514911165 hasConceptScore W2514911165C191897082 @default.
• W2514911165 hasConceptScore W2514911165C192562407 @default.
• W2514911165 hasConceptScore W2514911165C27501479 @default.
• W2514911165 hasConceptScore W2514911165C2780026712 @default.
• W2514911165 hasConceptScore W2514911165C31258907 @default.
• W2514911165 hasConceptScore W2514911165C41008148 @default.
• W2514911165 hasConceptScore W2514911165C45206210 @default.
• W2514911165 hasConceptScore W2514911165C48940184 @default.
• W2514911165 hasConceptScore W2514911165C50296614 @default.
• W2514911165 hasConceptScore W2514911165C69357855 @default.
• W2514911165 hasConceptScore W2514911165C74214498 @default.
• W2514911165 hasConceptScore W2514911165C97355855 @default.
• W2514911165 hasLocation W25149111651 @default.
• W2514911165 hasOpenAccess W2514911165 @default.
• W2514911165 hasPrimaryLocation W25149111651 @default.
• W2514911165 hasRelatedWork W1502452635 @default.
• W2514911165 hasRelatedWork W1510746996 @default.
• W2514911165 hasRelatedWork W1526618133 @default.
• W2514911165 hasRelatedWork W1531395846 @default.
• W2514911165 hasRelatedWork W1825337682 @default.
• W2514911165 hasRelatedWork W1997496084 @default.
• W2514911165 hasRelatedWork W2032696425 @default.
• W2514911165 hasRelatedWork W2053578931 @default.
• W2514911165 hasRelatedWork W2068414124 @default.
• W2514911165 hasRelatedWork W2107748584 @default.
• W2514911165 hasRelatedWork W2126775683 @default.
• W2514911165 hasRelatedWork W2138922190 @default.
• W2514911165 hasRelatedWork W2155476953 @default.
• W2514911165 hasRelatedWork W2346210796 @default.
• W2514911165 hasRelatedWork W2541896637 @default.
• W2514911165 hasRelatedWork W2778545030 @default.
• W2514911165 hasRelatedWork W2784555109 @default.
• W2514911165 hasRelatedWork W2797139801 @default.

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