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- W2518352605 abstract "The effects of cooling processes of the hot bar lift-up time and the silica filler content of solder ACFs polymer resin on the crack formation at SnBi58 solder ACFs joint were investigated to obtain higher solder ACFs joint reliability. As a summary, complete removal of the solder crack at acrylic based ACF joints could be obtained by delaying hot bar lift-up time, until the temperature was cooled below the glass transition temperature of acrylic resin during cooling process, or adding more than 10 wt% of silica filler content into acrylic resins. Moreover, very reliable solder joint morphology and stable joint contact resistance were obtained after 1000 cycles T/C reliability due to removing solder cracks completely." @default.
- W2518352605 created "2016-09-16" @default.
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- W2518352605 date "2016-05-01" @default.
- W2518352605 modified "2023-09-26" @default.
- W2518352605 title "Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability" @default.
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- W2518352605 doi "https://doi.org/10.1109/ectc.2016.152" @default.
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