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• W2518890480 abstract "The microstructure and mechanical properties of Zn-25Sn-XAl ( X=0, 0.01, 0.03, 0.05, 0.09 wt% ) high temperature Pb-free solders were investigated. The addition of Al tends to refine the grain size and depress the undercooling behavior of the solder. The needle-like zinc-rich phase of the eutectic region was coarsened upon Al addition. The increasing addition of Al up to 0.09 wt% enhanced the ultimate tensile strength (UTS) of the alloy from 67.28 to 78.61 MPa (16.84% improved), and the yield strength from 42.52 to 52.81 MPa (24.2% improved). The strain of the solder degraded from 39.02–32.83% when the addition of Al ranged from 0 to 0.09 wt%." @default.
• W2518890480 created "2016-09-23" @default.
• W2518890480 creator A5077252340 @default.
• W2518890480 creator A5090364702 @default.
• W2518890480 date "2016-11-01" @default.
• W2518890480 modified "2023-09-28" @default.
• W2518890480 title "The microstructure and mechanical properties of Zn-25Sn-XAl (X=0–0.09wt%) high temperature lead free solder" @default.
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• W2518890480 doi "https://doi.org/10.1016/j.msea.2016.09.061" @default.
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