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- W2519550630 abstract "The results of investigation of thermal linear expansion for high temperature thermoelectric material nanostructured Si0.8Ge0.2P0.022 n-type with maximum thermoelectric figure of merit Z = 0.98 10-3 K are presented. Investigations were carried out by dilatometric method in the temperature range from 300 to 1220 K in dynamic heating and cooling regimes with using of infrared radiation source. Temperature dependence of thermal linear expansion coefficient (TLEC) was analyzed. The average value of TLEC for Si0.8Ge0.2P0.022 was determined, which is equal to ~5.910-6 K-1." @default.
- W2519550630 created "2016-09-23" @default.
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- W2519550630 date "2016-08-01" @default.
- W2519550630 modified "2023-09-26" @default.
- W2519550630 title "Investigation of thermal linear expansion for nanostructured Si0.8Ge0.2P0.022in wide temperature range" @default.
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- W2519550630 doi "https://doi.org/10.1088/1742-6596/741/1/012203" @default.
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