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- W2521637292 abstract "A study of the fundamental issues of materials integration for wafer bonding offers new pathways for achieving photonic materials with unique properties. First, the bonding of single crystal oxide crystals (YAG and yttria, for example) with different compositions and even different orientations is shown to critically depend upon several important parameters. A detectable level of subsurface damage usually accompanies the polishing of these crystals. We studied chemical mechanical polishing (CMP) of these oxide crystals to provide surfaces which exhibit sub-nm roughness, and the absence of subsurface damage. These surfaces are then activated and we use XPS and other surface sensitive techniques to assess the state of the surface after different processes. Next, we demonstrate that we can significantly reduce the bonding time and temperature to attach two single crystal pieces based on these improved polishing techniques. These techniques also apply to polycrystalline (ceramic) materials as well. Second, a controlled variation in laser gain media can be achieved using a combination of wafer bonding and dopant ion implantation. We demonstrate the steps necessary to bond, for example, thin slabs of ZnSe which have been implanted with different doses of Cr. Upon bonding (after the appropriate CMP of the ZnSe surfaces) and subsequent annealing, these structures can exhibit controlled levels for example, Cr+ without the excessive annealing associated with transition metal doping of bulk substrates. These examples shed light on new directions in the use of materials integration for photonic crystals. Mark S. Goorsky, J Phys Chem Biophys 2013, 3:5 http://dx.doi.org/10.4172/2161-0398.S1.002" @default.
- W2521637292 created "2016-09-30" @default.
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- W2521637292 date "2013-10-31" @default.
- W2521637292 modified "2023-09-28" @default.
- W2521637292 title "Development of materials integration for photonic materials and applications" @default.
- W2521637292 hasPublicationYear "2013" @default.
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