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- W2521663725 abstract "By selecting a proper blade, sectioning the device under compression, placing it so that the feature of interest is at the trailing edge, and selecting a proper abrasive and cloth, the polishing process is able to resolve minute details which are easy to obliterate if not prepared properly. By taking corrective steps damage to the device can be minimized." @default.
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- W2521663725 date "2002-08-01" @default.
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- W2521663725 title "Metallography of Microelectronic Devices / Metallographie mikroelektronischer Bauteile" @default.
- W2521663725 doi "https://doi.org/10.1515/pm-2002-390807" @default.
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