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- W2525146888 abstract "We demonstrate self-aligned InGaAs FinFETs with sub-20 nm fin width fabricated through a CMOS compatible front-end process. Working devices with fins as narrow as 7 nm, fin aspect ratios in excess of 5 and gate lengths as short as 20 nm have been fabricated using precision dry etching and digital etch. The devices also feature self-aligned metal contacts that are 20–30 nm away from the edge of the gate. FinFETs with L g =30 nm, W f =22 nm and channel height of 40 nm exhibit a transconductance of 1400 µS/µm at V DS =0.5 V. When normalized to W f , this is a record value among all III–V FinFETs, indicating that our device architecture makes efficient use of conduction along the fin sidewalls." @default.
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- W2525146888 date "2016-06-01" @default.
- W2525146888 modified "2023-09-27" @default.
- W2525146888 title "High aspect ratio InGaAs FinFETs with sub-20 nm fin width" @default.
- W2525146888 doi "https://doi.org/10.1109/vlsit.2016.7573408" @default.
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