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- W2526879411 abstract "Bonding wafers prior to a wet etching step is a desirable yet complex process step. The use of the polymer BCB offers a low temperature alternative to direct or indirect bonding techniques. The tests presented in this paper show that bonded regions maintain their strength even for etched depths of 500 μm (8 hours in 35% KOH at 80°C), independently of the coating of the wafer. The tests also stress the importance of matching the thermal coefficients of the bonded wafers. This technique aims at the realization of a variable capacitor optimized for energy harvesting." @default.
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- W2526879411 date "2005-01-01" @default.
- W2526879411 modified "2023-09-27" @default.
- W2526879411 title "Combining BCB with KOH : wet bulk micromachining versus wafer bonding" @default.
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