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- W2527698772 abstract "In order to adapt the harsh service condition of the interconnects between the power semiconductors (chips) and substrates, there is an urgent need to develop alternative interconnect materials. Hybrid silver pastes consisting of microscale Ag flakes, nanoscale or sub-microscale Ag particles and volatile solvents have been considered as one of the most promising candidates. In this study, a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles has been prepared and the mechanical property of sintered hybrid paste joints is investigated. During the preparation of the hybrid paste, microscale Ag-plated Cu flakes are used to replace microscale Ag flakes in order to reduce the materials cost. Results show that the covering degree of Ag plated on Cu increases to almost 100% which are plated for three times after sensibilization. After Ball-milling, the Ag-plated Cu flakes become smoother and smaller in size. The average shear strength of sintered joints of the hybrid paste with Ag-plated Cu flakes maintains half of that of the pure Ag hybrid paste." @default.
- W2527698772 created "2016-10-14" @default.
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- W2527698772 date "2016-08-01" @default.
- W2527698772 modified "2023-09-22" @default.
- W2527698772 title "Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints" @default.
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- W2527698772 doi "https://doi.org/10.1109/icept.2016.7583281" @default.
- W2527698772 hasPublicationYear "2016" @default.
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