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• W2528053750 startingPage "116601" @default.
• W2528053750 abstract "Abstract A method based on contact resonance atomic force microscopy (AFM) was proposed to determine the mechanical properties of thin films. By analyzing the contact resonance frequencies of an AFM probe while the tip was in contact with the sample, the stiffness and residual stress of a freestanding circular SiN x membrane were evaluated quantitatively. The obtained magnitude of residual stress was in reasonable agreement with that determined by wafer curvature measurement. The method was verified to have much better mechanical sensitivity than the popular AFM bending test method. Its promising application to fast, nondestructive mechanical mapping of thin-film-type structures at the nanoscale was also demonstrated." @default.
• W2528053750 created "2016-10-14" @default.
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• W2528053750 date "2016-10-06" @default.
• W2528053750 modified "2023-10-16" @default.
• W2528053750 title "Measuring stiffness and residual stress of thin films by contact resonance atomic force microscopy" @default.
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• W2528053750 doi "https://doi.org/10.7567/apex.9.116601" @default.
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