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- W2528276073 abstract "With the development of science and technology, the electronic devices trend to miniaturization and high-density integration. And the nano-scale device becomes the inevitable trend. The thermal dissipation question was concerned as following. The thermal conductivity of graphene and silicon heterostructure is investigated by molecular dynamic simulation in this paper. The relationship between thermal conductivity and temperature is analyzed when the contact defect area is from 0 to 35%. The thermal conductivity of the model is calculated from 300K to 800K. It was found that when the temperature was between 300K∼800K, the thermal conductivity of the perfect heterostructure showed a decreasing tendency. However, when the temperature was between 300K∼500K, the thermal conductivity showed slowly rising tendency. When the defect contact area of heterostructure's reached to 35%, it was thought that the main reason for the decrease of thermal conductivity affected by the temperature was the coupling of the graphene phonon ZA mode and silicon wave. Our results show that graphene can enhance the thermal transfer properties of silicon nanofilm. The investigation implies that graphene can open up opportunities for MEMS/NEMS devices." @default.
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- W2528276073 date "2016-08-01" @default.
- W2528276073 modified "2023-09-24" @default.
- W2528276073 title "Study on the thermal conductivity of graphene/Si interface structure based on molecular dynamics" @default.
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- W2528276073 doi "https://doi.org/10.1109/icept.2016.7583215" @default.
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