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- W2532907146 abstract "Three-dimensional integrated circuit (3DIC) technologies with the vertical stacking schemes offer the promising performances but are sensitive to the post-bond probe in the testing reliability. In order to overcome this test challenge, the direct probe interface is applied and the performances of chip are also demonstrated. By using the direct probe interface, the post-bond chips have gained with 48% bandwidth enhancement and the test cost is also reduced in the whole test flow due to the reusable characteristics." @default.
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- W2532907146 date "2012-12-01" @default.
- W2532907146 modified "2023-09-24" @default.
- W2532907146 title "Bandwidth enhancement in 3DIC CoWoS<sup>™</sup> test using direct probe technology" @default.
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- W2532907146 doi "https://doi.org/10.1109/edaps.2012.6469436" @default.
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