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- W2533184206 abstract "This paper presents a detailed simulation study on the body doping effect on scaling of ultrathin silicon-on-insulator (SOI) MOSFETs with standard thick buried oxide (BOX). By employing high-k dielectrics, it is demonstrated that the minimum scalable channel length L <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>min</sub> for fully-depleted (FD) SOI MOSFETs can be significantly improved from L <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>min</sub> ~5t <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>Si</sub> for undoped case to L <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>min</sub> ~2t <sub xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>Si</sub> with doping. By scaling the gate insulator thickness toward its tunneling limit, it is possible to scale doped body FDSOI to ITRS 45 nm technology node (TN). Quantum mechanical and threshold considerations will ultimately limit how high a body doping can be used" @default.
- W2533184206 created "2016-10-28" @default.
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- W2533184206 date "2006-09-01" @default.
- W2533184206 modified "2023-09-27" @default.
- W2533184206 title "Effect of Body Doping on the Scaling of Ultrathin SOI MOSFETs" @default.
- W2533184206 cites W2133747703 @default.
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- W2533184206 doi "https://doi.org/10.1109/sispad.2006.282894" @default.
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