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- W2533362761 abstract "This paper gives a survey of the measures and the resulting improvements of IGBT module reliability reached by eupec during the introduction of IGBT high power modules. The points of improvement are in the areas of: bonding; base plate; partial discharge; and chip characteristics." @default.
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- W2533362761 date "2002-11-27" @default.
- W2533362761 modified "2023-10-12" @default.
- W2533362761 title "Further improvements in the reliability of IGBT modules" @default.
- W2533362761 doi "https://doi.org/10.1109/ias.1998.730271" @default.
- W2533362761 hasPublicationYear "2002" @default.
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