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- W2533734337 abstract "The characteristics of the tape automated bonding (TAB) technique are discussed. New bumping technologies and inner lead bonding methods are described. It is concluded that the TAB technique is applicable for future high-pin-count and high-speed devices: the existing technology offers reliable interconnects. >" @default.
- W2533734337 created "2016-10-28" @default.
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- W2533734337 date "2002-12-04" @default.
- W2533734337 modified "2023-09-25" @default.
- W2533734337 title "Tape-automated-bonding" @default.
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- W2533734337 doi "https://doi.org/10.1109/iemt8.1990.171062" @default.
- W2533734337 hasPublicationYear "2002" @default.
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