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• W2533759515 abstract "A method for determining higher order thermal coefficients for electrical and thermal properties of metallic interconnect materials used in semiconductor fabrication is presented. By applying inverse modeling on transient electrothermal three-dimensional finite element simulations the measurements of resistance over time of polysilicon fuse structures can be matched. This method is intended to be applied to the optimization of polysilicon fuses for reliability and speed." @default.
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• W2533759515 date "2004-03-23" @default.
• W2533759515 modified "2023-10-14" @default.
• W2533759515 title "Optimization of electrothermal material parameters using inverse modeling [polysilicon fuse interconnects]" @default.
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• W2533759515 doi "https://doi.org/10.1109/essderc.2003.1256889" @default.
• W2533759515 hasPublicationYear "2004" @default.
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