Matches in SemOpenAlex for { <https://semopenalex.org/work/W2533882502> ?p ?o ?g. }
- W2533882502 abstract "With the trend of electronic consumer product toward more functionality, high performance and miniaturization, IC chip is required to deliver more I/Os signals and better electrical characteristics under same package form factor. Thus, Flip Chip BGA (FCBGA) package was developed to meet those requirements offering better electrical performance, more I/O pins accommodation and high transmission speed. For high-speed application, the low dielectric constant (low-k) material that can effectively reduce the signal delays is extensively used in IC chips. However, the low-k material possesses fragile mechanical property and high coefficient of thermal expansion (CTE) compared with silicon chip, which raises the reliability concerns of low-k material integrated into IC chip. The typical reliability failure modes are low-k layer delamination and bump crack under temperature loading during assembly and reliability test. Delamination is occurred in the interface between low-k dielectric layers and underfill material at chip corner. Bump crack is at Under Bump Metallization (UBM) corner. Thus, the adequate underfill material selection becomes very important for both solder bump and low-k chips [1]. This paper mainly characterized FCBGA underfill materials to guide the adequate candidates to prevent failures on low-k chip and solder bump. Firstly, test vehicle was a FCBGA package with heat spreader and was investigated the thermal stress by finite element models. In order to analyze localized low-k structures, sub-modeling technique is used for underfill characterizations. Then, the proper underfill candidates picked from modeling results were experimentally validated by reliability tests. Finally, various low-k FCBGA package structures were also studied with same finite element technique." @default.
- W2533882502 created "2016-10-28" @default.
- W2533882502 creator A5021919907 @default.
- W2533882502 creator A5034136242 @default.
- W2533882502 creator A5053520516 @default.
- W2533882502 creator A5084535146 @default.
- W2533882502 date "2006-01-01" @default.
- W2533882502 modified "2023-09-27" @default.
- W2533882502 title "Underfill Assessments and Validations for Low-k FCBGA" @default.
- W2533882502 cites W2097774642 @default.
- W2533882502 cites W2165411238 @default.
- W2533882502 doi "https://doi.org/10.1115/imece2006-15432" @default.
- W2533882502 hasPublicationYear "2006" @default.
- W2533882502 type Work @default.
- W2533882502 sameAs 2533882502 @default.
- W2533882502 citedByCount "12" @default.
- W2533882502 countsByYear W25338825022012 @default.
- W2533882502 countsByYear W25338825022014 @default.
- W2533882502 countsByYear W25338825022015 @default.
- W2533882502 crossrefType "proceedings-article" @default.
- W2533882502 hasAuthorship W2533882502A5021919907 @default.
- W2533882502 hasAuthorship W2533882502A5034136242 @default.
- W2533882502 hasAuthorship W2533882502A5053520516 @default.
- W2533882502 hasAuthorship W2533882502A5084535146 @default.
- W2533882502 hasConcept C119599485 @default.
- W2533882502 hasConcept C121332964 @default.
- W2533882502 hasConcept C126233035 @default.
- W2533882502 hasConcept C127413603 @default.
- W2533882502 hasConcept C151730666 @default.
- W2533882502 hasConcept C153294291 @default.
- W2533882502 hasConcept C159985019 @default.
- W2533882502 hasConcept C160671074 @default.
- W2533882502 hasConcept C163258240 @default.
- W2533882502 hasConcept C165005293 @default.
- W2533882502 hasConcept C177564732 @default.
- W2533882502 hasConcept C186260285 @default.
- W2533882502 hasConcept C192562407 @default.
- W2533882502 hasConcept C204530211 @default.
- W2533882502 hasConcept C24326235 @default.
- W2533882502 hasConcept C2779227376 @default.
- W2533882502 hasConcept C30239060 @default.
- W2533882502 hasConcept C31555180 @default.
- W2533882502 hasConcept C43214815 @default.
- W2533882502 hasConcept C49040817 @default.
- W2533882502 hasConcept C50296614 @default.
- W2533882502 hasConcept C530198007 @default.
- W2533882502 hasConcept C58097730 @default.
- W2533882502 hasConcept C62520636 @default.
- W2533882502 hasConcept C68928338 @default.
- W2533882502 hasConcept C77928131 @default.
- W2533882502 hasConcept C78519656 @default.
- W2533882502 hasConcept C79072407 @default.
- W2533882502 hasConcept C86803240 @default.
- W2533882502 hasConcept C94709252 @default.
- W2533882502 hasConceptScore W2533882502C119599485 @default.
- W2533882502 hasConceptScore W2533882502C121332964 @default.
- W2533882502 hasConceptScore W2533882502C126233035 @default.
- W2533882502 hasConceptScore W2533882502C127413603 @default.
- W2533882502 hasConceptScore W2533882502C151730666 @default.
- W2533882502 hasConceptScore W2533882502C153294291 @default.
- W2533882502 hasConceptScore W2533882502C159985019 @default.
- W2533882502 hasConceptScore W2533882502C160671074 @default.
- W2533882502 hasConceptScore W2533882502C163258240 @default.
- W2533882502 hasConceptScore W2533882502C165005293 @default.
- W2533882502 hasConceptScore W2533882502C177564732 @default.
- W2533882502 hasConceptScore W2533882502C186260285 @default.
- W2533882502 hasConceptScore W2533882502C192562407 @default.
- W2533882502 hasConceptScore W2533882502C204530211 @default.
- W2533882502 hasConceptScore W2533882502C24326235 @default.
- W2533882502 hasConceptScore W2533882502C2779227376 @default.
- W2533882502 hasConceptScore W2533882502C30239060 @default.
- W2533882502 hasConceptScore W2533882502C31555180 @default.
- W2533882502 hasConceptScore W2533882502C43214815 @default.
- W2533882502 hasConceptScore W2533882502C49040817 @default.
- W2533882502 hasConceptScore W2533882502C50296614 @default.
- W2533882502 hasConceptScore W2533882502C530198007 @default.
- W2533882502 hasConceptScore W2533882502C58097730 @default.
- W2533882502 hasConceptScore W2533882502C62520636 @default.
- W2533882502 hasConceptScore W2533882502C68928338 @default.
- W2533882502 hasConceptScore W2533882502C77928131 @default.
- W2533882502 hasConceptScore W2533882502C78519656 @default.
- W2533882502 hasConceptScore W2533882502C79072407 @default.
- W2533882502 hasConceptScore W2533882502C86803240 @default.
- W2533882502 hasConceptScore W2533882502C94709252 @default.
- W2533882502 hasLocation W25338825021 @default.
- W2533882502 hasOpenAccess W2533882502 @default.
- W2533882502 hasPrimaryLocation W25338825021 @default.
- W2533882502 hasRelatedWork W1559571005 @default.
- W2533882502 hasRelatedWork W1947712349 @default.
- W2533882502 hasRelatedWork W1991291398 @default.
- W2533882502 hasRelatedWork W2018914183 @default.
- W2533882502 hasRelatedWork W2055211982 @default.
- W2533882502 hasRelatedWork W2114951300 @default.
- W2533882502 hasRelatedWork W2145241099 @default.
- W2533882502 hasRelatedWork W2157640222 @default.
- W2533882502 hasRelatedWork W2160493172 @default.
- W2533882502 hasRelatedWork W2533882502 @default.
- W2533882502 isParatext "false" @default.
- W2533882502 isRetracted "false" @default.
- W2533882502 magId "2533882502" @default.