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- W2534857792 abstract "Soldering lead-free solders and copper substrate using microwave heating has been technically challenging due to reflection of microwaves. This reflection effect is the biggest issues that need to be considered in order to get successful joint between solder/pad interfaces. This study investigates the intermetallics formation on SAC405 lead-free solders and copper pad by using microwave energy. Graphite and iron powder was used as susceptor material to facilitate microwave heating. Different amount of susceptor were used to compare its effect to the solder joint microstructure. Bonding to form the solder joints was made by domestic microwave oven with operating frequency of 2.45GHz and 800W for 80 seconds. Characterization of material was conducted through optical microscope (OM), Image Analyzer and Field Emission Scanning Electron Machine (FESEM). The results revealed that just after soldering process, only Cu6Sn5 intermetallic compound (IMC) is formed between solder and copper pad. By using optical microscope, the average thickness of the intermetallics was measured and it was found that the high amount of susceptor produced thicker IMC than the small amount of susceptor during microwave soldering." @default.
- W2534857792 created "2016-10-28" @default.
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- W2534857792 date "2016-01-01" @default.
- W2534857792 modified "2023-10-14" @default.
- W2534857792 title "Intermetallic compound formation on lead-free solders by using microwave energy" @default.
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- W2534857792 doi "https://doi.org/10.1063/1.4965116" @default.
- W2534857792 hasPublicationYear "2016" @default.
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