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- W2535269081 abstract "X-ray diffraction has been used in conjunction with standard metallography to study the formation and growth of copper-tin intermetallic compounds and their effect on surface morphology on solder-coated printed-circuit boards. The diffraction technique lends itself very well to the detection of these compounds and to the monitoring of their evolution during thermal aging, especially in cases where coatings are so thin that various constituent phases cannot otherwise be discussed. Some growth characteristics revealed by this nondestructive method are presented. >" @default.
- W2535269081 created "2016-10-28" @default.
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- W2535269081 date "1988-01-01" @default.
- W2535269081 modified "2023-09-26" @default.
- W2535269081 title "X-ray diffraction study of copper-time intermetallic compounds on solder-coated PC boards" @default.
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- W2535269081 doi "https://doi.org/10.1109/emts.1988.16167" @default.
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